| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MP2145GD-Z | 电源IC |
MPS/美国芯源 |
QFN |
1746+ |
4771 |
|||
| SN65HVD230QD | 接口IC |
TI/德州仪器 |
SOP8 |
21+ |
920 |
|||
| EPORT-E10 | iotworkshop |
MODULE |
17+ |
1948 |
||||
| STR-A6061HD | 其他被动元件 |
SANKEN/三垦 |
DIP7 |
19+ |
3121 |
|||
| PMW3360DM-T2QU | 单片机MCU |
INFINEON/英飞凌 |
DIP16 |
20+ |
700 |
|||
| GW2A-LV18EQ144C8/I7 | GOWIN/高云 |
LQFP144 |
1917+ |
720 |
||||
| NJU3716AVC2(TE1) | JRC/新日本无线 |
SSOP24 |
23+ |
6000 |
||||
| OC6781 | OCX/欧创芯 |
ESOP8 |
1925+ |
11040 |
||||
| MAX202ECSE+T | 接口IC |
MAXIM/美信 |
SOP |
11+21+ |
2463 |
|||
| SIT1042AQTK/3 | SIT/芯力特 |
DFN |
23+ |
1392 |
||||
| GW2AR-LV18EQ144C8/I7 | GOWIN/高云 |
LQFP144 |
1924+ |
70 |
||||
| GW1N-UV4PG256C6/I5 | GOWIN/高云 |
BGA256 |
2017+ |
2800 |
||||
| TS5A23157DGSR | 逻辑IC |
TI/德州仪器 |
MSOP10 |
1244+ |
19846 |
|||
| HR911105A | HANRUN/汉仁 |
RJ45 |
24+ |
1500 |
||||
| SY7301AADC | LED驱动IC |
SILERGY/矽力杰 |
SOT23-6 |
2043+ |
3000 |
|||
| AT24C32A-10PU-2.7 | 其他被动元件 |
ATMEL/爱特梅尔 |
DIP8 |
1135+ |
9500 |
|||
| TC358870XBG | 其他被动元件 |
TOSHIBA/东芝 |
BGA |
1544+ |
561 |
|||
| MP8009GV-Z | MPS/美国芯源 |
QFN |
2445+ |
259 |
||||
| 24LC512-I/SN | 存储IC |
MICROCHIP/微芯 |
SOP8 |
18+21+ |
24064 |
|||
| HD6417710FV | RENESAS/瑞萨 |
QFP |
17+ |
337 |
商家默认展示20条库存